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'AirPods 3' to adopt SiP technology similar to AirPods Pro, Kuo says
Apple's next-generation in-ear AirPods product will move to a more complex system-in-package chip solution, replacing surface mount technology used in current versions of the device, according to TF Securities analyst Ming-Chi Kuo. Compared to SMT technology, SiP systems typically enable manufacturers to pack more components into a smaller space. Apple's AirPods Pro, for example, employs an SiP design with an Apple-designed H1 chip that handles audio, Siri commands, noise-cancelling capabilities and more.